Project Salamander
Thermal materials for AI infrastructure

We do not cool AI chips.
We route heat.

A passive materials layer that stops heat spreading where it does damage and speeds it toward the cold plate. Built from fire-safety chemistry. Solid state, and it fits the racks you already run.

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The problem

Cooling is now the second largest cost in an AI datacenter, and it still is not buying performance.

Data center rack detail, dense cabling
$59M a year

The gap between an average operator and a best in class one, on a 100 MW site. Part of it is invisible. A rack pushed outside its cooling envelope throttles by up to half while every monitor still reports healthy.

$30M

That sits on top of the extra cooling plant a site buys trying to prevent it. Operators run their water colder than the chips are designed for, just to hold some margin.

600 kW

Rack density arriving in 2027. It was 40 kW in 2023. Every generation buys less headroom than the last.

Extreme macro of a chip die surface

Extracting heat faster is a race to a ceiling. Routing it is a different discipline.

Where we fit

The industry is racing to remove heat faster. Controlling where it goes is the missing layer.

Active cooling

Cold plates · CDUs · immersion

Removes heat from the rack. Mandatory now, and close to its limit. We work alongside it.

Interface materials

Pastes · pads · films

Move heat in one direction, down into the sink. They cannot stop it leaking sideways into the components that fail first.

VigentWorks

The routing layer

A passive layer that decides where heat goes. It blocks the sideways path and opens the downward one. Fits the racks you already run.

Extreme macro of cold plate microchannels
The chemistry

Insulation that survives inside a chip package.

Insulation is easy. Air does it for free. The hard part is surviving where it has to live. A chip package passes through solder reflow at 260 °C, three times, then years of heating and cooling under load. Most insulating materials are destroyed on the first pass.

Building one that survives is a chemistry problem, and it is the problem our field has spent 25 years solving. The semiconductor industry has attacked heat from the cooling side for two decades. We come at it from the containment side.

SOLDER REFLOW PROFILEWHAT THE MATERIAL MUST SURVIVE
260 °C PASS 1 PASS 2 PASS 3
What we make

One material, deployed three ways.

Barrier layer

Blocks the sideways path heat takes into the components least able to survive it. Built into the package at manufacture, or applied at the cold plate interface to hardware already running.

Interface layer

Replaces the thermal interface at the cold plate and opens the downward path. Serviceable in the field.

Sprayable coating

A retrofit form for surfaces that cannot take a film.

Solid state throughout, with no fluids and no PFAS. Compatible with the liquid cooling already in your racks.

Every degree of thermal margin we give back is worth about 4% of the cooling energy bill, or the option to run the water warmer and delete the chiller.

Where we start

Retrofit thermal performance for the fleets already running.

The next generation of cooling is being built into the silicon itself. It cannot be added to a chip that already exists, which means the millions of accelerators already installed will never receive it. Those fleets are where we start.

Dense wall of installed rack hardware with status lights
THE INSTALLED BASE
The measurements

What we measure.

How well it blocks
Against the standard the industry uses.
How well it conducts
Against the best commercial material available.
Whether it protects the neighbour
Two heat sources side by side, under real load and real liquid cooling.

INDEPENDENT LABORATORY

Two of these measurements have never been published. We will publish them first.

The team

25 years taking new thermal materials through certification and into production.

Our co-founder designs, certifies and manufactures barrier materials today, from three production sites, UL and EN certified, with in-house R&D. Rated, tested, and shipping.

This is where most new thermal materials fail. Certification and production qualification take 12–18 months, and that capability cannot be acquired after the fact. We have completed this cycle before.

We have taken new thermal materials from formulation to shipping product before. That is the part most materials companies never finish.

25 yrs
DESIGNING & SHIPPING BARRIER MATERIALS
3
PRODUCTION SITES, RUNNING TODAY
UL · EN
CERTIFIED · RATED, TESTED, SHIPPING
3×
FORM FACTORS: BARRIER · COATING · INTERFACE
Background: Photo by Lakshya soni on Unsplash
The technology

Directional control, from a solid layer.

Copper spreads heat in every direction at once, including into the components least able to take it. Our layer is built to be almost impassable in one direction and open in the other. Nothing moves and nothing wears out.

TEMPERATURE FIELD · LIVE SOLVEWITH THE LAYER IN
SOLID STATENO FLUIDSNO PFASNO MOVING PARTS
Technical summary

Full technical detail, available on request.

The measurement plan, test protocols, standards, integration points and benchmark references are available on request. Material composition and process details remain proprietary.

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Book a call

20 minutes with the team.

If you build or operate AI infrastructure, we'll take you through the measurement plan and scope an evaluation on your hardware.

Book a call